Effect of Cr and Ni Plating Varanasi (Basahi) Industry Effluent on Seed Germination and Physiology of Cicer arietinum cv.G-130 and Cicer arietinum cv.H-208 Leguminous Crop Plants

Chromium and Nickel are widely used in electroplating to manufacture imitation ornaments, parts of automobiles, ovens and many other domestic and commercial uses. Excessive use of above indicated heavy metals for electroplating has caused pollution of soil and water. All concentrations of Chromium and Nickel used were found inhibitory to seedling growth. Study of different sites of Chromium and Nickel Varanasi (Basahi) plating industry effluents on germination and growth of Cicer arietinum cv. G-130 and Cicer arietinum cv. For seedling growth studies, pre-radicle emergence treatment seeds were pre-treated with three sites (Site-I, Site-II and Site-III) of factory effluent solutions. H-208 leguminous crop plants were carried out. Chromium and Nickel-plating effluents used from three sites were inhibitory for seed germination for all the cultivars of the test plants. The maximum inhibition in seed germination and growth was reported in site I where as it was maximum concentration. Among two cultivars of Cicer arietinum cv. H-208 was found to be more susceptible to Chromium and Nickel-plating effluent toxicity than cv. G-130. In this way, differential responses were shown by above stated genotypes of Cicer arietinum to Chromium and Nickel-plating effluent toxicity.